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Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB

    Buy cheap Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB from wholesalers
     
    Buy cheap Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB from wholesalers
    • Buy cheap Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB from wholesalers
    • Buy cheap Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB from wholesalers

    Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 8 layers Anylayer 5G high speed high frequency mixed pressure HDIPCB
    Certification : ISO/UL/RoHS/TS
    Price : 12.8/USD
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : 20-25/day
    • Product Details
    • Company Profile

    Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB

    8 layers Anylayer 5G high speed high frequency mixed pressure HDIPCB
    8-Layer Anylayer, 5G optical module
    RT6010.2LM+M7, TG240, Anylayer, minimum line width 3/3mil, minimum hole 0.10mm, mechanical blind hole, electric gold + immersion gold, green oil, white
    Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
    Standard.
    Quantities range from prototype to volume production.
    100% E-Test
    PCB, FPC process production capability

    Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    Our service

    1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB)
    2. PCBA contract manufacturing
    3. Electronic contract manufacturing service
    4. Through hole assembly/DIP assembly
    5. Bonding assembly
    6. Final assembly
    7. Full Turnkey Box Build
    8. Mechanical / electrical assembly
    9. Supply Chain Management/Components procurement
    10. PCB fabrication
    11. Technical support

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PCB, FPC main material supplier

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

    Quality Assurance:
    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements

    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic productsFAQ:

    FAQ

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB

    standard.

    Quality Double Sided PCB Board Service 5G High Speed High Frequency Mixed Pressure HDIPCB for sale
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