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10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

    Buy cheap 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production from wholesalers
     
    Buy cheap 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production from wholesalers
    • Buy cheap 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production from wholesalers
    • Buy cheap 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production from wholesalers
    • Buy cheap 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production from wholesalers

    10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : PCB+SMT+DIP+PCBA production
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : PCB 20 days / PCBA three days
    Certification : ISO/UL/RoHS/TS
    • Product Details
    • Company Profile

    10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

    10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed


    Product Description


    1. 10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
    2. High Speed SMT PCB Assembly Lea,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
    3. Industrial product series
    4. 10-layer PCB production, purchasing components, SMT+DIP+ plug-in production
    5. Packing: Pearl anti-static film / vacuum packaging / plastic box
    6. PCB, FPC process production capability

    7. One stop services:
    8. PCB layout
    9. Electronic design
    10. Engineering
    11. PCB fabrication
    12. PCB Assembly
    13. Box Build
    14. IC Programming
    15. Testing
    16. Parts sourcing
    17. Supply management
    18. After sales servies et

      Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    PCB capability and services:

    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
    2. Flexible PCB (up to 10 layers)
    3. Rigid-flex PCB (up to 8 layers) CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    4. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    5. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    6. Quantities range from prototype to volume production.
    7. 100% E-Test

    PCB Assembly services:

    1. SMT Assembly
    2. Automatic Pick & Place
    3. Component Placement as Small as 0201
    4. Fine Pitch QEP - BGA
    5. Automatic Optical Inspection

    Through-hole Assembly

    1. Wave Soldering
    2. Hand Assembly and Soldering
    3. Material Sourcing
    4. IC pre-programming / Burning on-line
    5. Function testing as requested
    6. Aging test for LED and Power boards
    7. Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    8. Packing design

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole


    Certificate:

    IPC Standard

    ISO9001

    ISO/TS16949

    UL


    Testing and value added services:

    AOI (Automatic optical inspection)

    ICT(In-circuit test)

    Reliability test

    X-Ray Test

    Analogue and digital function test

    Firmware programming


    Shipping Method and Payment terms:

    1. By DHL, UPS, FedEx, TNT, or using clients account.

    2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.

    3. By sea for mass quantity according to customer's requirement.

    4. By customer's Forwarder

    6. T/T, West Union, etc.


    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray


    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: How can I know the process of my PCB production?
    A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    Quality 10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production for sale
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