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Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

    Buy cheap Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color from wholesalers
     
    Buy cheap Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color from wholesalers
    • Buy cheap Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color from wholesalers

    Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 18-layer PCB production, purchasing components
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : PCB 20 days / PCBA three days
    Certification : ISO/UL/RoHS/TS
    • Product Details
    • Company Profile

    Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

    18-layer HDI3 order PCB production component purchasing SMT DIP,pcb production ,wooden box, pcb service processing carton packaging,wooden box,SMT PCB Service

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


    Product Description

    1. 18-layer HDI3 order PCB production component purchasing SMT DIP processing ,carton packaging,wooden box,SMT PCB Service
    2. 18-layer automotive product PCBA
    3. 18-layer HDI3 order PCB production component purchasing SMT DIP processing
    4. Detailed Product Description
    5. PCBA processing method
    6. PCB production + it contains SMT, DIP, TEST,
    7. Helpset, assembled OEM factory
    8. 2: Electronic materials supply or our purchasing method

    PCBA multiple packaging methods:

    1. Inner box for electrostatic film simple packaging + wooden box or carton packaging
    2. inner box plastic box + wooden box or carton packaging
    3. vacuum packaging + wooden box or carton packaging
    4. Packing is done according to your requirements
    5. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
    6. PCB, FPC process production capability

    Specifications

    - Contract Manufacturing

    - Engineering Services

    - PCB Design & Assembly

    - Product Design

    - Prototyping

    - Cable and Wire Assemblies

    - Plastics and Molds


    PCB capability and services:
    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
    2. Flexible PCB (up to 10 layers)
    3. Rigid-flex PCB (up to 8 layers)
    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    7. Quantities range from prototype to volume production.
    8. 100% E-Test


    PCBA capabilities:
    Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly

    Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection

    PCB board components, including all types of BGAs, QFNs, CSPs, 0201, 01005, POP, and Pressfit Components in small quantities

    Part Polarity Capacitors, SMT Polarized Capacitors, and Through-Hole Polarized Capacitors

    ROHS capability


    IPC-A-610E and IPC/EIA-STD workmanship operation

    PCB,FPCProcess capability table

    Technical ltem

    MassProduct

    Advanced Technology

    2016

    2017

    2018

    Max.Layer Count

    26L

    36L

    80L

    Through-hole plate

    2~45L

    2~60L

    2~80L

    Max.PCBSize(in)

    24*52"

    25*62"

    25*78.75"

    The layer number of FPC

    1~36L

    1~50L

    1~60L

    Max.PCBSize(in)

    9.8"*196"

    9.8"*196"

    10"*196"Reel to reel

    Layeredplatelayer

    2~12L

    2~18L

    2~26L

    Max.PCBSize(in)

    9"*48"

    9"*52"

    9"*62"

    Combination of hard and soft layers

    3~26L

    3~30L

    3~50L

    Interconnect HDI

    5+X+5Interconnect HDI

    7+X+7Interconnect HDI

    8+X+8,Interconnect HDI

    HDI PCB

    4~45L

    4~60L

    4~80L

    Interconnect HDI

    3+20+3

    4+X+4Interconnect HDI

    4+X+4,Interconnect HDI

    Max.PCBSize(in)

    24"*43"

    24"*49"

    25"*52"

    Material

    FR-4 Rogers

    FR-4 Rogers

    FR-4 Rogers

    Base material

    Halogenfree,LowDK

    Halogenfree,LowDK

    Halogenfree,LowDK

    Build-up Material

    FR-4

    FR-4

    FR-4

    BOard,Thickness(mm)

    Min.12L(mm)

    0.43

    0.42~8.0mm

    0.38~10.0mm

    Min.16L(mm)

    0.53

    1.60~8.0mm

    0.45~10.0mm

    Min.18L(mm)

    0.63

    2.0~8.0

    0.51~10.0mm

    Min.52L(mm)

    0.8

    2.50~8.0mm

    0.65~10.0mm

    MAX(mm)

    3.5

    10.0mm

    10.0mm

    Min.CoreThickness um(mil)

    254"(10.0)

    254"(10.0)

    0.10~254(10.0mm)

    Min.Build up Dielectric

    38(1.5)

    32(1.3)

    25(1.0)

    BaseCopperWeight

    Inner Layer

    4/1-8 OZ

    4/1-15 OZ

    4/1-0.30mm

    Out Layer

    4/1-10 OZ

    4/1-15 OZ

    4/1-30 OZ

    Gold thick

    1~40u"

    1~60u"

    1~120u"

    Nithick

    76~127u"

    76~200u"

    1~250u"

    Min.HOle/Land um(mil)

    150/300(6/12)

    100/200(4/8)

    100/200(4/8)

    Min.Laser via/landum(mil)

    60/170(2.4/6.8)

    50/150(2/6)

    50/150(2/6)

    Min. IVH,Hole size/landum(mil)

    150/300(6/12)

    100/200(4/8)

    100/200(4/8)

    DieletricThickness

    38(1.5)

    32(1.3)

    32(1.3)

    125(5)

    125(5)

    125(5)

    SKipvia

    Yes

    Yes

    Yes

    viaoNhie(laserviaon BuriedPTH)

    Yes

    Yes

    Yes

    Laser Hole Filling

    Yes

    Yes

    Yes

    Technicalltem

    Mass Product

    Advanced Technolgy

    2017year

    2018year

    2019year

    Drill hole depth ratio

    ThroughHole

    2017year

    .40:1

    .40:1

    Aspet Ratio

    Micro Via

    .35:1

    1.2:1

    1.2:1

    Copper Filling Dimple Size um(Mil)

    10(0.4)

    10(0.4)

    10(0.4)

    Min.LineWidth&space

    lnner Layer um(mil)

    45/45(1.8/1.8)

    38/38(1.5/1.5)

    38/38(1.5/1.5)

    Plated Layer um(mil)

    45/45(1.8/1.8)

    38/38(1.5/1.5)

    38/38(1.5/1.5)

    BGAPitch mm(Mil)

    0.3

    0.3

    0.3

    Min.PTH Hole ring um(mil)

    75(3mil)

    62.5(2.5mil)

    62.5(2.5mil)

    Line Width Control

    ∠2.5MIL

    ±0.50

    ±0.50

    ±0.50

    2.5Mil≤L/W∠4mil

    ±0.50

    ±0.50

    ±0.50

    ≦3mil

    ±0.60

    ±0.60

    ±0.60

    Laminated structure

    Layer by layer

    3+N+3

    4+N+4

    5+N+5

    Sequential Build-up

    20L Any Layer

    36L Any Layer

    52L Any Layer

    Multi-layer overlay

    N+N

    N+N

    N+N

    N+X+N

    N+X+N

    N+X+N

    sequential Lamination

    2+(N+X+N)+2

    2+(N+X+N)+2

    2+(N+X+N)+2

    Soft and hard bonding

    2+(N+X+N)+2

    2+(N+X+N)+2

    2+(N+X+N)+2

    PTH filling process

    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole


    PCB, FPC main material supply

    NO

    supplier

    Supply material name

    Material origin

    1

    Japan

    High frequency materials, PI, covering membrane,Copper berth

    Mitsubishi Japan

    2

    dupont

    High frequency materials, PI, covering film, dry film,Copper berth

    Japan

    3

    panasonic

    High frequency materials, PI, covering membrane,Copper berth

    Japan

    4

    SanTie

    PI, covering membrane

    Japan

    5

    Born good

    FR-4,PI,PP,Copper berth

    shenzhen, China

    6

    A rainbow

    PI, covering membrane,Copper berth

    Taiwan

    7

    teflon

    High frequency materials

    The United States

    8

    Rogers

    High frequency materials

    The United States

    9

    Nippon Steel

    PI, covering membrane,Copper berth

    Taiwan

    10

    sanyo

    PI, covering membrane,Copper berth

    Japan

    11

    South Asia

    FR-4,PI,PP,Copper berth

    Taiwan

    12

    doosan

    FR-4,PP

    South Korea

    13

    Tai Yao plate

    FR-4,PP,Copper berth

    Taiwan

    14

    Alight

    FR-4,PP,Copper berth

    Taiwan

    15

    Yaoguang

    FR-4,PP,Copper berth

    Taiwan

    16

    Yalong

    FR-4,PP

    The United States

    17

    ISOAL

    FR-4,PP

    Japan

    18

    OAK

    Buried, buried resistance, PP

    Japan

    19

    United States 3M

    FR-4,PP

    The United States

    20

    Bergs

    Copper and aluminum matrix

    Japan

    21

    The sun

    ink

    Taiwan

    22

    Murata

    ink

    Japan

    23

    generous andbenevolent

    PI, covering membrane,Copper berth

    China's jiangxi

    24

    Yasen

    PPI, covering membrane

    China jiangsu

    25

    Yong Sheng Tai

    ink

    China guangdong panyu

    26

    mita

    ink

    Japan

    27

    Transcript

    ceramic material

    Taiwan

    28

    HOME

    ceramic material

    Japan

    29

    Fe-Ni-Mn

    Alloy Invar, Section Steel

    Taiwan


    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products


    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: How can I know the process of my PCB production?
    A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.

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