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Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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    Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers
     
    Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers
    • Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers
    • Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers
    • Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers
    • Buy cheap Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering from wholesalers

    Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin
    Certification : ISO/UL/RoHS/TS
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : 25-35day
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    Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering

    4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin Drone product immersion goldpcb,High FrequencyPCB


    Product Description

    1. 4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin circuit boards PCB Board Service,4L plate thicknesssize902*902mm,rigid flex printed +SMT+Plugin Drone product,immersion gold pcb,Drone products, oversize
    2. Product area: Drone product
    3. Number of layers:
    4. 4L plate thickness: 1.0mm+SMT+Plugin+Electronic material purchasing
    5. Size: 902*902mm/1PCS
    6. Process structure:
    7. high frequency FR-4TG170+LSOLA, minimum hole 0.250mm,
    8. minimum line width 4/4mil Impedance Ω ± 10%
    9. Packing: vacuum packaging + moisture-proof beads + humidity card + wooden box or carton packaging
    10. Printed circuit board (pcb) and PCBA product areas
      Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
      Winding circuit board (fpc) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    PCBA capabilities:

    1. Fast prototyping
    2. High mix, low and medium volume build
    3. SMT MinChip:0201
    4. BGA: 1.0 to 3.0 mm pitch
    5. Through-hole assembly
    6. Special processes (such as conformal coating and potting)
    7. ROHS capability
    8. IPC-A-610E and IPC/EIA-STD workmanship operation

    PCB Assembly services:

    1. SMT Assembly
    2. Automatic Pick & Place
    3. Component Placement as Small as 0201
    4. Fine Pitch QEP - BGA
    5. Automatic Optical Inspection

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


    Advantages:
    1. Turnkey manufacturing or quick-turn prototypes
    2. Board-level assembly or complete system integration
    3. Low-volume or mixed-technology assembly for PCBA
    4. Even consignment production
    5. Supoorted capabilities


    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    Complete box build
    Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
    plastics, casings and print & packaging material


    Testing Methods

    AOI Testing
    Checks for solder paste
    Checks for components down to 0201"
    Checks for missing components, offset, incorrect parts, polarity
    X-Ray Inspection
    X-Ray provides high-resolution inspection of:
    BGAs
    Bare boards


    In-Circuit Testing
    In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
    component problems.
    Power-up Test
    Advanced Function Test
    Flash Device Programming
    Functional testing


    Quality Processes:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection (FAI) for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949


    Design file format:
    1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
    2. BOM (bill of materials)
    3. Pick and place file (XYRS)


    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.


    Quality Rigid Flex Printed Large PCB Prototype Board SMT+Plugin Drone Product Immersion Gold + SMT + plug-in + back soldering for sale
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