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Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

    Buy cheap Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test from wholesalers
     
    Buy cheap Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test from wholesalers
    • Buy cheap Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test from wholesalers
    • Buy cheap Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test from wholesalers

    Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

    Ask Lasest Price
    Model Number : 18 layersPCB​,SMT PCB Assembly With FR4 Material Thickness 1.6mm Green Solder Mask Copper 1OZ AOI X-Ray Function Test CE Rohs Standard
    Brand Name : China chao sheng
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : 20-25 working days
    Price : Negotiation
    Certification : Negotiation
    • Product Details
    • Company Profile

    Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

    18 layersPCB​,SMTPCB Assembly FR-4+TG180, thickness 3.50mm,Green Solder Mask Copper 1OZ AOI X-Ray Function Test CE


    Product Description

    1. Product area: industrial products
    2. Product structure: 18 layersPCB, FR-4+TG180, component purchase,
      SMT+PID high frequency mixing, laser hole 0.10mm, copper hole filling,
    3. inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, thickness 3.50mm, Immersion Gold 2u", size 850*420mm

    4. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Technical requirement

    1. Professional surface-mounting and through-hole soldering technology
    2. Various sizes are available, like 1206, 0805, 0603 components SMT technology
    3. ICT (in circuit test), FCT (functional circuit test) technology
    4. PCB assembly with UL, CE, FCC and RoHS approvals
    5. Nitrogen gas reflow soldering technology for SMT
    6. High standard SMT and solder assembly line
    7. High density interconnected board placement technology capacity

    Advantages:
    1. Turnkey manufacturing or quick-turn prototypes
    2. Board-level assembly or complete system integration
    3. Low-volume or mixed-technology assembly for PCBA
    4. Even consignment production
    5. Supoorted capabilities


    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    SMT Assembly
    Automatic Pick & Place
    Component Placement as Small as 0201
    Fine Pitch QEP - BGA
    Automatic Optical Inspection

    Through-hole Assembly
    Wave Soldering
    Hand Assembly and Soldering
    Material Sourcing
    IC pre-programming / Burning on-line
    Function testing as requested
    Aging test for LED and Power boards
    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    Packing design

    PCB Assembly services:
    Conformal coating
    Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
    applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
    contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
    When coated, it is clearly visible as a clear and shiny material.

    Complete box build
    Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
    plastics, casings and print & packaging material


    Detailed Specification of PCB Manufacturing

    1layer1-30 layer
    2MaterialCEM-1, CEM-3 FR-4, FR-4 High TG,
    Polyimide,
    Aluminum-based
    material.
    3Board thickness0.2mm-6mm
    4Max.finished board size800*508mm
    5Min.drilled hole size0.25mm
    6min.line width0.075mm(3mil)
    7min.line spacing0.075mm(3mil)
    8Surface finishHAL, HAL Lead free,Immersion Gold/
    Silver/Tin,
    Hard Gold, OSP
    9Copper thickness0.5-4.0oz
    10Solder mask colorgreen/black/white/red/blue/yellow
    11Inner packingVacuum packing,Plastic bag
    12Outer packingstandard carton packing
    13Hole tolerancePTH:±0.076,NTPH:±0.05
    14CertificateUL,ISO9001,ISO14001,ROHS,TS16949
    15Profiling punchingRouting,V-CUT,Beveling

    Testing Methods
    AOI Testing
    Checks for solder paste
    Checks for components down to 0201"
    Checks for missing components, offset, incorrect parts, polarity
    X-Ray Inspection
    X-Ray provides high-resolution inspection of:
    BGAs
    Bare boards

    In-Circuit Testing
    In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
    component problems.
    Power-up Test
    Advanced Function Test
    Flash Device Programming
    Functional testing

    Quality Processes:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection (FAI) for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

    Design file format:
    1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
    2. BOM (bill of materials)
    3. Pick and place file (XYRS)


    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.


    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    Quality Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test for sale
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