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Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG

    Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers
     
    Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers
    • Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers
    • Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers
    • Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers
    • Buy cheap Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG from wholesalers

    Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Delivery Time : 30-35day
    Certification : ISO/UL/RoHS/TS
    Supply Ability : 5-200K/pcs per month
    • Product Details
    • Company Profile

    Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG


    10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing,SMT PCB Service smt pcb assembly


    Product Description

    1. 10-layer automotive product PCBA
    2. 10 layer HDI4 order + PCB production + component purchasing + SMT + DIP processing
    3. Packing requirements: vacuum packaging, electrostatic film, plastic box (optional one,
    4. blister box packaging requires additional billing + carton packaging)
    5. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    One stop services

    1. PCB layout
    2. Electronic design
    3. Engineering
    4. PCB fabrication
    5. PCB Assembly
    6. Box Build
    7. IC Programming
    8. Testing
    9. Parts sourcing
    10. Supply management
    11. After sales servies et

    PCB capability and services

    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

    2. Flexible PCB (up to 10 layers)

    3. Rigid-flex PCB (up to 8 layers)

    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.

    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.

    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.

    7. Quantities range from prototype to volume production.

    8. 100% E-Test


    PCB Assembly services

    1. SMT Assembly
    2. Automatic Pick & Place
    3. Component Placement as Small as 0201
    4. Fine Pitch QEP - BGA
    5. Automatic Optical Inspection

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    Through-hole Assembly
    Wave Soldering
    Hand Assembly and Soldering

    Material Sourcing

    IC pre-programming / Burning on-line

    Function testing as requested

    Aging test for LED and Power boards

    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)

    Packing design


    Certificate:

    IPC Standard

    ISO9001

    ISO/TS16949

    UL


    Testing and value added services:

    AOI (Automatic optical inspection)

    ICT(In-circuit test)

    Reliability test

    X-Ray Test

    Analogue and digital function test

    Firmware programming


    Shipping Method and Payment terms:

    1. By DHL, UPS, FedEx, TNT, or using clients account.

    2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.

    3. By sea for mass quantity according to customer's requirement.

    4. By customer's Forwarder

    6. T/T, West Union, etc.

    Quality Multilayer Printed Circuit SMT DIP Processing 1oz Copper Thickness High TG for sale
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