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Communication IC Package Substrate Aluminum Base ENIG Surface Finishing

Communication IC Package Substrate Aluminum Base ENIG Surface Finishing

Communication IC Package Substrate Aluminum Base ENIG Surface Finishing

1 layer COF communication liquid crystal driver,IC Circuit Board Product Description Product area: communication liquid crystal driver Number of layers: 1 layer COF Plate thickness: 0.12mm, Panasonic ...

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molded interconnect substrate

      

pcb substrate

      
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